Erschienen in:
09.01.2016 | Original Article
Effect of ultrasonic tip and root-end filling material on bond strength
verfasst von:
Rodrigo Ricci Vivan, Juliane Maria Guerreiro-Tanomaru, Ricardo Affonso Bernardes, José Mauricio Santos Nunes Reis, Marco Antonio Hungaro Duarte, Mário Tanomaru-Filho
Erschienen in:
Clinical Oral Investigations
|
Ausgabe 8/2016
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Abstract
Objectives
The objective of this study was to evaluate the bond strength of three root-end filling materials (MTAA–MTA Angelus, MTAS–experimental MTA Sealer, and ZOE- zinc oxide and eugenol cement) in retrograde preparations performed with different ultrasonic tips (CVD, Trinity, and Satelec).
Materials and method
Ninety 2-mm root sections from single-rooted human teeth were used. The retrograde cavities were prepared by using the ultrasonic tips, coupled to a device for position standardization. The specimens were randomly divided into nine groups: CVD MTAA; CVD MTAS; CVD ZOE; Trinity MTAA; Trinity MTAS; Trinity ZOE; Satelec MTAA; Satelec MTAS; Satelec ZOE. Each resin disc/dentin/root-end filling material was placed in the machine to perform the push-out test. The specimens were examined in a stereomicroscope to evaluate the type of failure. Data were submitted to statistical analysis using ANOVA and Tukey tests (α = 0.05).
Results
The highest bond strength was observed for the CVD tip irrespective of the material used (P < 0.05). There was no significant difference for the Trinity TU-18 diamond and S12 Satelec tips (P > 0.05). MTAA and MTAS showed highest bond strength. The most common type of failure was adhesion between the filling material and dentin wall, except for ZOE, where mixed failure was predominant.
Conclusions
The CVD tip favored higher bond strength of the root-end filling materials. MTA Angelus and experimental MTAS presented bond strength to dentin prepared with ultrasonic tips.
Clinical relevance
Root-end preparation with the CVD tip positively influences the bond strength of root-end filling materials. MTA Angelus and experimental MTAS present bond strength to be used as root-end filling materials.